From: Chengwen Feng <fengchengwen@huawei.com>
Date: Thu, 22 Apr 2021 02:05:02 +0000 (+0800)
Subject: net/bonding: fix leak on remove
X-Git-Url: http://git.droids-corp.org/?a=commitdiff_plain;h=144dc4739975;p=dpdk.git

net/bonding: fix leak on remove

If the bond device was created by vdev mode, the kvlist was not free
when the bond device removed.

Fixes: 8d30fe7fa737 ("bonding: support port hotplug")
Cc: stable@dpdk.org

Signed-off-by: Chengwen Feng <fengchengwen@huawei.com>
Signed-off-by: Min Hu (Connor) <humin29@huawei.com>
Reviewed-by: Ferruh Yigit <ferruh.yigit@intel.com>
---

diff --git a/drivers/net/bonding/rte_eth_bond_pmd.c b/drivers/net/bonding/rte_eth_bond_pmd.c
index 2e9cea5b8e..25b1f771a1 100644
--- a/drivers/net/bonding/rte_eth_bond_pmd.c
+++ b/drivers/net/bonding/rte_eth_bond_pmd.c
@@ -3467,6 +3467,8 @@ bond_remove(struct rte_vdev_device *dev)
 		ret = bond_ethdev_stop(eth_dev);
 		bond_ethdev_close(eth_dev);
 	}
+	if (internals->kvlist != NULL)
+		rte_kvargs_free(internals->kvlist);
 	rte_eth_dev_release_port(eth_dev);
 
 	return ret;