From 0920029bd7cded3f6bd0d0413f67e764c0af9b61 Mon Sep 17 00:00:00 2001
From: Michal Jastrzebski <michalx.k.jastrzebski@intel.com>
Date: Fri, 27 May 2016 17:20:52 +0200
Subject: [PATCH] app/test: fix bond device name too long

Bond device name was too long (grather than 32 signs) that
cause mempool allocation to fail.

Fixes: 92073ef961ee ("bond: unit tests")

Signed-off-by: Michal Jastrzebski <michalx.k.jastrzebski@intel.com>
Acked-by: Bernard Iremonger <bernard.iremonger@intel.com>
Tested-by: Huilong Xu <huilongx.xu@intel.com>
---
 app/test/test_link_bonding.c | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/app/test/test_link_bonding.c b/app/test/test_link_bonding.c
index 7cbc289140..eeb139546f 100644
--- a/app/test/test_link_bonding.c
+++ b/app/test/test_link_bonding.c
@@ -83,7 +83,7 @@
 #define MAX_PKT_BURST			(512)
 #define DEF_PKT_BURST			(16)
 
-#define BONDED_DEV_NAME			("unit_test_bonded_device")
+#define BONDED_DEV_NAME			("unit_test_bond_dev")
 
 #define INVALID_SOCKET_ID		(-1)
 #define INVALID_PORT_ID			(-1)
-- 
2.20.1