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(parent: 6b1a001) | patch
app/testpmd: add command to show LACP bonding info
authorChengchang Tang <tangchengchang@huawei.com>
Fri, 24 Sep 2021 09:57:20 +0000 (17:57 +0800)
committerFerruh Yigit <ferruh.yigit@intel.com>
Mon, 11 Oct 2021 13:37:53 +0000 (15:37 +0200)
commit1dc6665d364b06ad44423f9dfac3818924950593
treedd4f984fd71f566928430a657c672191ff47c344tree | snapshot
parent6b1a001ec54635d63ed3f91eaef5164abee7a089commit | diff
app/testpmd: add command to show LACP bonding info

Add a new cmdline to help diagnostic the bonding mode 4 in testpmd.

Show the lacp information about the bonded device and its slaves:
show bonding lacp info <bonded device port_id>

Signed-off-by: Chengchang Tang <tangchengchang@huawei.com>
Signed-off-by: Min Hu (Connor) <humin29@huawei.com>
Acked-by: Xiaoyun Li <xiaoyun.li@intel.com>
app/test-pmd/cmdline.c diff | blob | history
doc/guides/testpmd_app_ug/testpmd_funcs.rst diff | blob | history
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