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(parent: 393c891) | patch
app/test: fix bond device name too long
authorMichal Jastrzebski <michalx.k.jastrzebski@intel.com>
Fri, 27 May 2016 15:20:52 +0000 (17:20 +0200)
committerThomas Monjalon <thomas.monjalon@6wind.com>
Mon, 13 Jun 2016 20:14:10 +0000 (22:14 +0200)
commit0920029bd7cded3f6bd0d0413f67e764c0af9b61
tree9ba1d8930527461d68367dd668df6d171f522190tree | snapshot
parent393c891ff1ad1484a4f2cb8267636ead2c0de2c8commit | diff
app/test: fix bond device name too long

Bond device name was too long (grather than 32 signs) that
cause mempool allocation to fail.

Fixes: 92073ef961ee ("bond: unit tests")

Signed-off-by: Michal Jastrzebski <michalx.k.jastrzebski@intel.com>
Acked-by: Bernard Iremonger <bernard.iremonger@intel.com>
Tested-by: Huilong Xu <huilongx.xu@intel.com>
app/test/test_link_bonding.c diff | blob | history
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