app/test: fix bond device name too long
authorMichal Jastrzebski <michalx.k.jastrzebski@intel.com>
Fri, 27 May 2016 15:20:52 +0000 (17:20 +0200)
committerThomas Monjalon <thomas.monjalon@6wind.com>
Mon, 13 Jun 2016 20:14:10 +0000 (22:14 +0200)
Bond device name was too long (grather than 32 signs) that
cause mempool allocation to fail.

Fixes: 92073ef961ee ("bond: unit tests")

Signed-off-by: Michal Jastrzebski <michalx.k.jastrzebski@intel.com>
Acked-by: Bernard Iremonger <bernard.iremonger@intel.com>
Tested-by: Huilong Xu <huilongx.xu@intel.com>
app/test/test_link_bonding.c

index 7cbc289..eeb1395 100644 (file)
@@ -83,7 +83,7 @@
 #define MAX_PKT_BURST                  (512)
 #define DEF_PKT_BURST                  (16)
 
-#define BONDED_DEV_NAME                        ("unit_test_bonded_device")
+#define BONDED_DEV_NAME                        ("unit_test_bond_dev")
 
 #define INVALID_SOCKET_ID              (-1)
 #define INVALID_PORT_ID                        (-1)